With a selection of high-performance substrates, including G10/FR4, G11/FR5, Non-Brominated G10, and G9, these laminates offer excellent mechanical strength, thermal stability, and electrical insulation. . TR-Clad™ Flexible Laminates combine NeXolve polyimide materials with copper foil to provide the lowest dielectric constant, thinnest, and lowest weight copper/polyimide laminates available. Additionally, TR-Clad™ is available with electrostatic dissipative polyimide. Also, please take a look at the list of 12 copper clad laminate manufacturers and their company rankings.
[PDF Version]
Menu
